PCI installs 3D colour cameras to expand blister packaging capabilities

PCI Pharma Services is installing 3D and high resolution colour camera technology for product inspection and fill control on three of its blister packaging lines at its site in Hay-on-Wye, Wales

With the ability to check shape, colour, size and markings, the new inspection cameras Lynx-Spectra 3D and Lynx-Spectra HR from Scanware ensure that each blister pack pocket is correctly filled with the allocated product, according to PCI.

The equipment also checks the depth and product thickness via the 3D aspect of the technology.  

The cameras enable staff to inspect products that are invisible to conventional two-dimensional black and white and colour systems – such as a gray capsule in a gray / cold form blister pockets, due to the contrast between the two gray colours being insufficient for the systems to detect. 

Scanware’s smart technology is able to identify and evaluate previously ‘invisible’ poorly contrasting product, using a combination of 3D and high resolution colour hardware, in conjunction with the proprietary scanware inspection software, according to PCI.

The cameras also enable PCI to check that the product is in the correct pocket, is of the correct thickness and is not damaged.

Commenting on the new technology, Paul Smallman, associate director technical services at PCI, said: “PCI Pharma Services is delighted to introduce the new 3D cameras to three of our existing blister lines at our Hay-on-Wye site.

“Most camera technologies on the market inspect for shape, size and markings on entry-level black and white systems and shape, colour, size and markings on higher level colour systems. It is very rare that a CMO will use 3D systems such as ours, as this type of customised and innovative high-end technology tends to be very product and line-specific.

“By working in close coordination with PCI, scanware managed to adapt its existing concept of a dedicated system to ensure a wide range of possibilities – both for current product designs and future requirements.”